Method of encapsulating a crystal oscillator
AssigneeMotorola, Inc.
InventorThomas A. Knecht
Life of this patent
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Abstract
A method of encapsulating a crystal oscillator (100). First, a dielectric material is assembled or connected to the bottom side of a lead frame (102). Second, oscillator components including a piezoelectric element, capacitors and an integrated circuit are attached on the lead frame (104). Third, an epoxy dam is dispensed around the periphery of the oscillator component locations (106). Fourth, a encapsulant is dispensed within the epoxy dam to encapsulate the oscillator components (108). Fifth, the epoxy dam and encapsulant are cured (110). Thereafter, the oscillator is singulated from the lead frame and the leads are formed for mounting (112).
Claims12
A method of making a surface mountable-lead frame crystal oscillator, comprising:
- assembling a lead frame with a dielectric layer, the lead frame includes a plurality of cells having top and bottom surfaces;
- attaching oscillator components to the top of the lead frame;
- dispensing a predetermined first viscous material to form a dam substantially around a periphery of each cell;
- substantially filling the dam with a second viscous material;
- curing the first and second viscous materials;
- and
- singulating each cell to form a surface-mountable lead frame crystal oscillator.
Dependencies are inferred from the claim text.