Package for piezo-oscillator
AssigneeMatsushima Kogyo Kabushiki Kaisha
InventorsIwao Nakayama, Kazushige Ichinose, Hiroyuki Ogiso
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Abstract
A piezo-oscillator includes a semiconductor element having at least an oscillating circuit. A piezo-vibrator having leads extending therefrom is connected to the semiconductor element by a plurality of lead terminals. The semiconductor, vibrator and lead terminals are contained within a unitary resin package.
Claims23
A piezo-oscillator package comprising a piezo-vibrator having a casing with an end portion, electrode extensions extending proximate the end portion of said casing, a semiconductor element having oscillating circuit means for oscillating said piezo-vibrator, lead terminals coupled to said semiconductor element, said electrode extensions of said piezo-vibrator being coupled to said lead terminals of said semiconductor element, said semiconductor element, lead terminals and piezo-vibrator being packaged in a unitary resin package formed by injecting resin through a resin port positioned proximate the outer periphery of said package proximate said end portion of said casing of said piezo-vibrator, said electrode extensions of said piezo-vibrator being positioned proximate the outer periphery of said package.
A piezo-oscillator package comprising a semiconductor element including an oscillating circuit, a piezo-vibrator having vibrator leads extending outwardly therefrom, lead terminals coupling the vibrator leads to the semiconductor element, shielding lead terminals disposed parallel to the vibrator lead terminals, the semiconductor element, the lead terminals, the piezo-vibrator and the shielding lead terminals all being contained within a unitary resin package, the vibrator lead terminals being disposed proximate the outer periphery of the package.
A piezo-oscillator package comprising a frame having an outer periphery, a piezo-vibrator having a casing with an end portion supported on the frame, electrode extensions extending proximate the end portion of the casing, a semiconductor element having oscillating circuit means for oscillating said piezo-oscillator supported on said frame, lead terminals coupled to said semiconductor element, said electrode extensions of said piezo-vibrator being coupled to said lead terminals of said semiconductor element, a port formed in said frame proximate said end portion of said casing of said piezo-vibrator, said electrode extensions of said piezo-vibrator being positioned proximate the outer periphery of said package, said semiconductor element, lead terminal and piezo-vibrator being packaged in a resin introduced through said port.
Dependencies are inferred from the claim text.