H10W 70/099
Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers
Official title: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
H10W70/099 (Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers) appears on 10,280 US grants and 11,708 published applications in this corpus.
Search patents in H10W- Granted patents
- 10,280
- Published applications
- 11,708
- Assignees
- 1,362
- Inventors
- 11,600
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 3 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 6 | 0 |
| 1986 | 5 | 0 |
| 1987 | 5 | 0 |
| 1988 | 9 | 0 |
| 1989 | 16 | 0 |
| 1990 | 14 | 0 |
| 1991 | 28 | 0 |
| 1992 | 34 | 0 |
| 1993 | 31 | 0 |
| 1994 | 35 | 0 |
| 1995 | 41 | 0 |
| 1996 | 42 | 0 |
| 1997 | 61 | 0 |
| 1998 | 69 | 0 |
| 1999 | 100 | 0 |
| 2000 | 80 | 0 |
| 2001 | 123 | 59 |
| 2002 | 134 | 128 |
| 2003 | 117 | 143 |
| 2004 | 117 | 186 |
| 2005 | 119 | 216 |
| 2006 | 152 | 228 |
| 2007 | 155 | 249 |
| 2008 | 128 | 330 |
| 2009 | 175 | 333 |
| 2010 | 255 | 318 |
| 2011 | 308 | 283 |
| 2012 | 256 | 344 |
| 2013 | 300 | 342 |
| 2014 | 350 | 416 |
| 2015 | 386 | 517 |
| 2016 | 473 | 535 |
| 2017 | 625 | 738 |
| 2018 | 664 | 718 |
| 2019 | 714 | 793 |
| 2020 | 717 | 943 |
| 2021 | 697 | 879 |
| 2022 | 687 | 819 |
| 2023 | 653 | 670 |
| 2024 | 590 | 659 |
| 2025 | 573 | 541 |
| 2026 | 215 | 321 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Packages with chips comprising inductor-vias and methods forming the same25 Aug 2026US 12,720,775 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Through-substrate-via in photosensitive module25 Aug 2026US 12,720,900 B2Semiconductor Components Industries, LLC
- Semiconductor package and method for manufacturing the same25 Aug 2026US 12,721,136 B2Samsung Electronics Co., Ltd.
- Methods related to dual-sided radio-frequency package with overmold structure25 Aug 2026US 12,721,179 B2Skyworks Solutions, Inc.
- Integrated circuit packages and methods of forming the same25 Aug 2026US 12,721,194 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Manufacturing method of redistribution layer8 Oct 2026US 2026/0310094 A1Shanghai AVIC Optoelectronics Co., Ltd.
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- Two-sided liquid cooling8 Oct 2026US 2026/0314413 A1Adeia Semiconductor Bonding Technologies Inc.
- Integrated circuit packages and methods of forming the same8 Oct 2026US 2026/0314429 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
Most cited
By later US patents
- Multicolor organic light emitting devices2,173US 5,707,745 AThe Trustees of Princeton University · 1998
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Packaged semiconductor device with a molding compound and a method of forming the same1,039US 9,000,584 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015