Methods related to dual-sided radio-frequency package with overmold structure

A method of implementing a wireless device comprising:

• providing a circuit board configured to receive a plurality of packaged modules;
• and
• implementing a radio-frequency module on the circuit board, the radio-frequency module including a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side, the radio-frequency module further including a package implemented on the first side of the packaging substrate, the package including a first overmold structure, the radio-frequency module further including a component mounted to the second side of the packaging substrate, the radio-frequency module further including a second overmold structure implemented on the second side, the second overmold structure substantially encapsulating at least a portion of the component and including an underside surface, the radio-frequency module further including a set of through-mold connections implemented on the second side of the packaging substrate, the set of through-mold connections defining a mounting area on the second side of the packaging substrate, each through-mold connection having an exposed surface substantially coplanar with the underside surface of the second overmold structure, each through-mold connection having the largest lateral dimension at or near the exposed surface substantially coplanar with the underside surface of the second overmold structure, each through-mold connection including a circular curvature and having a truncated circular shape that is a semicircular shape, and the exposed surface corresponding to the largest diameter of a corresponding circle.