Stepped trace design for impedance compensation of high-speed differential pair channels

A method for impedance compensation of high-speed printed circuit board (PCB) differential pair channels, comprising:

• providing a plurality of first trace pairs in a break-out region of a printed circuit board (PCB), wherein the plurality of first trace pairs have a first impedance;
• providing a plurality of second trace pairs in a main-route region of the PCB, wherein the plurality of second trace pairs have substantially the first impedance;
• coupling first ends of the plurality of the first trace pairs to connections of an integrated circuit socket;
• and
• coupling second ends of the plurality of the first trace pairs to first ends of the plurality of second trace pairs.

A system in a package (SiP), comprising:

• a substrate;
• a plurality of first trace pairs in at least one break-out region of the substrate;
• a plurality of second trace pairs in a main-route region of the substrate, wherein the plurality of first trace pairs have impedances substantially the same as the impedances of the second trace pairs;
• at least one integrated circuit in the at least one break-out region of the substrate;
• first ends of the plurality of the first trace pairs are coupled to connections of the at least one integrated circuit;
• and
• second ends of the plurality of the first trace pairs are coupled to first ends of the plurality of second trace pairs.