Semiconductor package manufacturing methods using hybrid die bonding with spin-on siloxane materials

A semiconductor package, comprising:

• a first semiconductor component and second semiconductor component bonded together with a bonding layer;
• wherein the bonding layer comprises:
• a first coating comprising a siloxane coating of the following formula:
• wherein R, R′, and R″ are each an alkyl group, an aryl group, a hydroxyl group, or an alkoxyl group, any of which may additionally contain a reactive functional group;
• w is 0-1.5;
• x is 0-1.5;
• y is 0-1.5;
• z is 1.2-2;
• and n is the number of repeating siloxane monomer units between 10-100000.

A method of fusing a first semiconductor component and a second semiconductor component to form a device, the method comprising:

• applying a first coating composition to a top surface of the first semiconductor component to form a first coated semiconductor component;
• applying a second coating composition to a top surface of the second semiconductor component to form a second coated semiconductor component;
• wherein at least one of the first coating composition and the second coating composition comprises a siloxane coating composition of the following formula:
• wherein R, R′, and R″ are each an alkyl group, an aryl group, a hydroxyl group, or an alkoxyl group, any of which may additionally contain a reactive functional group, wherein the alkyl group and/or the aryl group may each independently include one or more polar protic or aprotic functional groups selected from, but not limited to, hydroxyl, amino, or carboxyl functionalities;
• w is 0-1.5;
• x is 0-1.5;
• y is 0-1.5;
• z is 1.2-2;
• and n is the number of repeating siloxane monomer units between 10-100000
• wherein the siloxane coating composition is applied by spin-coating;
• contacting the top surface of the first coated semiconductor component and the top surface of the second coated semiconductor component forming the device;
• and
• curing the device in a final cure step at a temperature of 200-450° C. for at least 1 hour, optionally further comprising pre-curing the siloxane coating composition.