H10W 44/00
Electrical arrangements for controlling or matching impedance
H10W44/00 (Electrical arrangements for controlling or matching impedance) appears on 11,052 US grants and 12,071 published applications in this corpus.
Search patents in H10W- Granted patents
- 11,052
- Published applications
- 12,071
- Assignees
- 1,841
- Inventors
- 16,689
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 8 | 0 |
| 1978 | 9 | 0 |
| 1979 | 11 | 0 |
| 1980 | 11 | 0 |
| 1981 | 11 | 0 |
| 1982 | 11 | 0 |
| 1983 | 14 | 0 |
| 1984 | 9 | 0 |
| 1985 | 12 | 0 |
| 1986 | 17 | 0 |
| 1987 | 33 | 0 |
| 1988 | 33 | 0 |
| 1989 | 34 | 0 |
| 1990 | 40 | 0 |
| 1991 | 58 | 0 |
| 1992 | 59 | 0 |
| 1993 | 55 | 0 |
| 1994 | 56 | 0 |
| 1995 | 84 | 0 |
| 1996 | 77 | 0 |
| 1997 | 89 | 0 |
| 1998 | 96 | 0 |
| 1999 | 100 | 0 |
| 2000 | 121 | 0 |
| 2001 | 136 | 64 |
| 2002 | 208 | 278 |
| 2003 | 195 | 239 |
| 2004 | 217 | 250 |
| 2005 | 214 | 278 |
| 2006 | 214 | 276 |
| 2007 | 180 | 345 |
| 2008 | 199 | 320 |
| 2009 | 212 | 326 |
| 2010 | 283 | 349 |
| 2011 | 323 | 334 |
| 2012 | 318 | 342 |
| 2013 | 329 | 345 |
| 2014 | 357 | 428 |
| 2015 | 393 | 429 |
| 2016 | 466 | 436 |
| 2017 | 516 | 531 |
| 2018 | 503 | 604 |
| 2019 | 617 | 731 |
| 2020 | 623 | 885 |
| 2021 | 607 | 793 |
| 2022 | 680 | 765 |
| 2023 | 590 | 839 |
| 2024 | 619 | 732 |
| 2025 | 603 | 644 |
| 2026 | 389 | 508 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Power amplifier and radio frequency module6 Oct 2026US 12,756,368 B2Mitsubishi Electric Corporation
- Nitride semiconductor device6 Oct 2026US 12,757,465 B2Panasonic Holdings Corporation
- Package substrate with open air gap structures6 Oct 2026US 12,757,739 B2Intel Corporation
- Single layer and multilayer magnetic inductors between substrate cores6 Oct 2026US 12,757,740 B2Intel Corporation
- Semiconductor module6 Oct 2026US 12,757,768 B2Shindengen Electric Manufacturing Co., Ltd.
- Concentric dtc bumps for high density package decap solution8 Oct 2026US 2026/0313924 A1QUALCOMM Incorporated
- Semiconductor structure and method of manufacture8 Oct 2026US 2026/0313943 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Soi device structure for robust isolation8 Oct 2026US 2026/0313979 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Mesh inductors and antennas of electronic assemblies8 Oct 2026US 2026/0314395 A1Super Micro Computer, Inc.
- Integrated circuit packages and methods of forming the same8 Oct 2026US 2026/0314429 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Radio frequency circuit and memory in thin flexible package895US 5,528,222 AInternational Business Machines Corporation · 1996
- Packages with passive devices and methods of forming the same592US 8,680,647 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Saw-singulated leadless plastic chip carrier427US 6,229,200 B1ASAT Ltd. · 2001