Semiconductor module

A semiconductor module comprising:

• a plurality of semiconductor chips;
• a first power source terminal;
• a second power source terminal;
• a first intermediate point terminal and a second intermediate point terminal thus forming a bridge circuit in the semiconductor module, wherein
• the first power source terminal and the second power source terminal are disposed adjacently to each other,
• the first intermediate point terminal and the second intermediate point terminal are disposed adjacently to each other, and
• at a time using the semiconductor module, currents flow in opposite directions with respect to the first power source terminal and the second power source terminal, and currents flow in opposite directions with respect to the first intermediate point terminal and the second intermediate point terminal, and
• an outer lead portion of the first power source terminal and an outer lead portion of the second power source terminal, and an outer lead portion of the first intermediate point terminal and an outer lead portion of the second intermediate point terminal are disposed on a same side of the semiconductor module.