H10W 44/20
At high-frequency [hf] or radio frequency [rf]
Official title: at high-frequency [HF] or radio frequency [RF]
H10W44/20 (At high-frequency [hf] or radio frequency [rf]) appears on 8,005 US grants and 8,579 published applications in this corpus.
Search patents in H10W- Granted patents
- 8,005
- Published applications
- 8,579
- Assignees
- 1,447
- Inventors
- 11,932
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 8 | 0 |
| 1978 | 8 | 0 |
| 1979 | 7 | 0 |
| 1980 | 8 | 0 |
| 1981 | 9 | 0 |
| 1982 | 7 | 0 |
| 1983 | 8 | 0 |
| 1984 | 5 | 0 |
| 1985 | 5 | 0 |
| 1986 | 12 | 0 |
| 1987 | 16 | 0 |
| 1988 | 19 | 0 |
| 1989 | 22 | 0 |
| 1990 | 22 | 0 |
| 1991 | 31 | 0 |
| 1992 | 33 | 0 |
| 1993 | 28 | 0 |
| 1994 | 33 | 0 |
| 1995 | 58 | 0 |
| 1996 | 50 | 0 |
| 1997 | 60 | 0 |
| 1998 | 63 | 0 |
| 1999 | 64 | 0 |
| 2000 | 79 | 0 |
| 2001 | 96 | 42 |
| 2002 | 136 | 193 |
| 2003 | 142 | 169 |
| 2004 | 159 | 173 |
| 2005 | 151 | 208 |
| 2006 | 168 | 234 |
| 2007 | 132 | 270 |
| 2008 | 163 | 232 |
| 2009 | 163 | 241 |
| 2010 | 211 | 243 |
| 2011 | 228 | 241 |
| 2012 | 228 | 247 |
| 2013 | 251 | 249 |
| 2014 | 239 | 294 |
| 2015 | 268 | 297 |
| 2016 | 347 | 337 |
| 2017 | 386 | 412 |
| 2018 | 385 | 456 |
| 2019 | 471 | 587 |
| 2020 | 504 | 681 |
| 2021 | 467 | 582 |
| 2022 | 502 | 533 |
| 2023 | 427 | 592 |
| 2024 | 441 | 458 |
| 2025 | 404 | 371 |
| 2026 | 268 | 237 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Power amplifier and radio frequency module6 Oct 2026US 12,756,368 B2Mitsubishi Electric Corporation
- Package substrate with open air gap structures6 Oct 2026US 12,757,739 B2Intel Corporation
- Photosensitive resin composition, cured film, electronic component, antenna element, semiconductor package, and compound29 Sep 2026US 12,747,202 B2Toray Industries, Inc.
- Package structure with transmission line and method for manufacturing the same29 Sep 2026US 12,751,293 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems22 Sep 2026US 12,744,322 B2Intel Corporation
- Semiconductor structure and method of manufacture8 Oct 2026US 2026/0313943 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Soi device structure for robust isolation8 Oct 2026US 2026/0313979 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Mesh inductors and antennas of electronic assemblies8 Oct 2026US 2026/0314395 A1Super Micro Computer, Inc.
- Integrated circuit packages and methods of forming the same8 Oct 2026US 2026/0314429 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Waveguides and fabrication thereof1 Oct 2026US 2026/0302580 A1Jones Microwave Inc
Most cited
By later US patents
- Radio frequency circuit and memory in thin flexible package895US 5,528,222 AInternational Business Machines Corporation · 1996
- Saw-singulated leadless plastic chip carrier427US 6,229,200 B1ASAT Ltd. · 2001
- Leadless plastic chip carrier with etch back pad singulation413US 6,498,099 B1ASAT Ltd. · 2002
- Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system387US 7,619,901 B2EPIC Technologies, Inc. · 2009
- Linearity improvements of semiconductor substrate based radio frequency devices371US 7,868,419 B1RF Micro Devices, Inc. · 2011