Photosensitive resin composition, cured film, electronic component, antenna element, semiconductor package, and compound

A photosensitive resin composition comprising a polyfunctional monomer (A), a binder resin (B), and a photopolymerization initiator (C),

• wherein the polyfunctional monomer (A) contains a compound represented by expression (1) and/or a compound represented by expression (2), and the binder resin (B) contains one or more substance selected from the group consisting of a polyimide, a polyimide precursor, a polybenzoxazole, a polybenzoxazole precursor, a polyamide, a copolymer thereof, a polyurea, a polyester, a polysiloxane, an acrylic resin, a phenol resin, a benzocyclobutene resin, a maleic acid resin, and a cycloolefin polymer,
• wherein, in expression (1), W1 and W2 each independently represent a monovalent organic group having a carbon-carbon double bond and 2 to 25 carbon atoms, and a, b, c, and d are natural numbers each independently satisfying a+b=6 to 17 and c+d=8 to 19, and the broken line part means a carbon-carbon single bond or a carbon-carbon double bond,
• in expression (2), W3 and W4 each independently represent a monovalent organic group having a carbon-carbon double bond and 2 to 25 carbon atoms, and e, f, g, and h are each independently a natural number satisfying e+f=5 to 16 and g+h=8 to 19, and the broken line part means a carbon-carbon single bond or a carbon-carbon double bond,
• wherein, in expression (1) and expression (2), at least one of W1 and W2, and at least one of W3 and W4, are groups represented by expression (3) or expression (4),
• wherein, in expression (3) and expression (4), X and Y represent —NH—, R1 represents a single bond or a 2 to 6 valent organic group having 1 to 5 carbon atoms, R2 represents a single bond or a divalent organic group having 1 to 5 carbon atoms i represents an integer 1 to 5, and a sign of * indicates a point of bonding.