H10W 44/226
For hf amplifiers
Official title: {for HF amplifiers}
H10W44/226 (For hf amplifiers) appears on 1,511 US grants and 1,640 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,511
- Published applications
- 1,640
- Assignees
- 351
- Inventors
- 2,569
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 4 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 4 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 6 | 0 |
| 1988 | 5 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 8 | 0 |
| 1992 | 6 | 0 |
| 1993 | 4 | 0 |
| 1994 | 7 | 0 |
| 1995 | 6 | 0 |
| 1996 | 10 | 0 |
| 1997 | 15 | 0 |
| 1998 | 11 | 0 |
| 1999 | 13 | 0 |
| 2000 | 13 | 0 |
| 2001 | 14 | 6 |
| 2002 | 18 | 29 |
| 2003 | 18 | 21 |
| 2004 | 25 | 24 |
| 2005 | 14 | 23 |
| 2006 | 25 | 29 |
| 2007 | 12 | 27 |
| 2008 | 20 | 28 |
| 2009 | 16 | 32 |
| 2010 | 28 | 36 |
| 2011 | 32 | 32 |
| 2012 | 34 | 40 |
| 2013 | 45 | 45 |
| 2014 | 41 | 54 |
| 2015 | 48 | 66 |
| 2016 | 83 | 84 |
| 2017 | 84 | 95 |
| 2018 | 93 | 83 |
| 2019 | 95 | 99 |
| 2020 | 89 | 112 |
| 2021 | 81 | 142 |
| 2022 | 101 | 127 |
| 2023 | 94 | 144 |
| 2024 | 104 | 114 |
| 2025 | 95 | 89 |
| 2026 | 63 | 59 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Power amplifier and radio frequency module6 Oct 2026US 12,756,368 B2Mitsubishi Electric Corporation
- Power amplifier device having dies with elongated bondpads connected through a device substrate15 Sep 2026US 12,738,906 B2NXP USA, Inc.
- RF package and method of manufacture of an RF package15 Sep 2026US 12,740,425 B2NXP B. V.
- RF amplifiers with improved stability by source inductance adjustment15 Sep 2026US 12,740,427 B2MACOM Technology Solutions Holdings, Inc.
- Power amplifier modules and systems containing electromagnetic bandgap isolation arrays25 Aug 2026US 12,720,668 B2NXP USA, Inc.
- Bga-type radio-frequency device1 Oct 2026US 2026/0305363 A1STMicroelectronics International N. V.
- Devices and methods related to packaged modules having metal posts24 Sep 2026US 2026/0293780 A1Skyworks Solutions, Inc.
- Amplifier circuit10 Sep 2026US 2026/0269792 A1Sumitomo Electric Device Innovations, Inc.
- Semiconductor device10 Sep 2026US 2026/0271737 A1Sumitomo Electric Industries, Ltd.
- Rf amplifier devices and methods of manufacturing including modularized designs with flip chip interconnections and integration into packaging6 Aug 2026US 2026/0230051 A1Wolfspeed, Inc.
Most cited
By later US patents
- Saw-singulated leadless plastic chip carrier427US 6,229,200 B1ASAT Ltd. · 2001
- Leadless plastic chip carrier with etch back pad singulation413US 6,498,099 B1ASAT Ltd. · 2002
- Saw-singulated leadless plastic chip carrier339US 6,242,281 B1ASAT Ltd. · 2001
- Exposed die leadless plastic chip carrier303US 6,294,100 B1ASAT Ltd. · 2001
- Leadless plastic chip carrier with etch back pad singulation and die attach pad array138US 6,635,957 B2ASAT Ltd. · 2003