A power amplifier device for a Doherty power amplifier that includes a first amplifier with a first output, a second amplifier with a second output, an impedance inverter/phase delay structure coupled between the first and second outputs of the first and second amplifiers, and a combining node, the power amplifier device comprising:
- a first power transistor die with a first side and a second side that is perpendicular to the first side of the first power transistor die, wherein the first power transistor die includes
- a first bondpad that is elongated and exposed at a first surface of the first power transistor die, wherein the first bondpad has a first bondpad length that is at least five times greater than a first bondpad width, and the first bondpad length is aligned in parallel with the first side of the first power transistor die, and
- a first integrated transistor that includes a first terminal coupled to the first bondpad, wherein the first terminal corresponds to the first output of the first amplifier;
- a second power transistor die with a first side and a second side that is perpendicular to the first side of the second power transistor die, wherein the second side of the second power transistor die faces the second side of the first power transistor die, and the second power transistor die includes
- a second bondpad that is elongated and exposed at a first surface of the second power transistor die, wherein the second bondpad has a second bondpad length that is at least five times greater than a second bondpad width, and the second bondpad length is aligned in parallel with the first side of the second power transistor die, wherein the second bondpad is co-located with the combining node of the Doherty power amplifier, and
- a second integrated transistor that includes a second terminal coupled to the second bondpad, wherein the second terminal corresponds to the second output of the second amplifier;
- and
- a substrate formed from a stack of multiple dielectric layers and multiple patterned conductive layers in an alternating arrangement, and a plurality of conductive vias electrically coupling portions of the multiple patterned conductive layers, wherein the substrate includes
- a first die contact that is exposed at a first substrate surface and that is elongated and connected to the first bondpad across the first bondpad length of the first bondpad,
- a second die contact that is exposed at the first substrate surface and that is elongated and connected to the second bondpad across the second bondpad length of the second bondpad, and
- a conductive structure aligned in parallel with the first and second bondpad lengths and connected between the first and second die contacts, wherein the conductive structure is formed from portions of the patterned conductive layers and at least two vias of the plurality of conductive vias, wherein the conductive structure corresponds to the impedance inverter/phase delay element of the Doherty power amplifier with a first end coupled to the first output of the first amplifier, and a second end coupled to the second output of the second amplifier and to the combining node.