Devices and methods related to packaged modules having metal posts

A packaged module comprising:

• a packaging substrate having a first side and a second side;
• a package implemented on the second side of the packaging substrate and including an overmold with a mounting surface, the package further including a plurality of conductive posts configured to provide electrical connections for the packaged module, each conductive post formed from conductive material that does not melt during a mounting operation and having a side wall that is encapsulated by the overmold and a surface relative to the mounting surface;
• and
• a solderable material layer patterned to cover the surface of each conductive post.

A method for fabricating a packaged module, the method comprising:

• forming or providing a packaging substrate having a first side and a second side;
• implementing a package on the second side of the packaging substrate such that the package includes an overmold with a mounting surface, a plurality of conductive posts for electrical connections, with each conductive post being formed from conductive material that does not melt during a mounting operation and having a side wall that is encapsulated by the overmold and a surface relative to the mounting surface;
• and
• forming a solderable material layer to cover the surface of each conductive post.

A method for fabricating a packaged module, the method comprising:

• forming or providing a packaging substrate having a non-mounting side and a mounting side, and a plurality of conductive posts on the mounting side of the packaging substrate, the conductive posts formed from conductive material that does not melt during a mounting operation;
• mounting a component on the mounting side of the packaging substrate;
• forming an overmold on the mounting side of the packaging substrate;
• forming a mounting surface of the overmold to provide a surface of each conductive post relative to the mounting surface, and such that a side wall of each conductive post is encapsulated by the overmold;
• and
• forming a solderable material layer to cover the surface of each conductive post.