H10W 44/234
Arrangements for impedance matching
Official title: {Arrangements for impedance matching}
H10W44/234 (Arrangements for impedance matching) appears on 893 US grants and 1,069 published applications in this corpus.
Search patents in H10W- Granted patents
- 893
- Published applications
- 1,069
- Assignees
- 204
- Inventors
- 1,562
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 0 |
| 2002 | 3 | 4 |
| 2003 | 2 | 5 |
| 2004 | 2 | 3 |
| 2005 | 2 | 4 |
| 2006 | 6 | 3 |
| 2007 | 3 | 4 |
| 2008 | 3 | 6 |
| 2009 | 1 | 13 |
| 2010 | 9 | 10 |
| 2011 | 11 | 14 |
| 2012 | 15 | 23 |
| 2013 | 24 | 29 |
| 2014 | 19 | 36 |
| 2015 | 34 | 48 |
| 2016 | 56 | 58 |
| 2017 | 59 | 66 |
| 2018 | 63 | 61 |
| 2019 | 71 | 71 |
| 2020 | 64 | 85 |
| 2021 | 60 | 111 |
| 2022 | 82 | 100 |
| 2023 | 74 | 112 |
| 2024 | 83 | 87 |
| 2025 | 76 | 70 |
| 2026 | 53 | 46 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power amplifier and radio frequency module6 Oct 2026US 12,756,368 B2Mitsubishi Electric Corporation
- Power amplifier device having dies with elongated bondpads connected through a device substrate15 Sep 2026US 12,738,906 B2NXP USA, Inc.
- RF amplifiers with improved stability by source inductance adjustment15 Sep 2026US 12,740,427 B2MACOM Technology Solutions Holdings, Inc.
- Power amplifier modules and systems containing electromagnetic bandgap isolation arrays25 Aug 2026US 12,720,668 B2NXP USA, Inc.
- Integrated curcuit to dielectric substrate transition25 Aug 2026US 12,721,171 B2Analog Devices International Unlimited Company
- Bga-type radio-frequency device1 Oct 2026US 2026/0305363 A1STMicroelectronics International N. V.
- Devices and methods related to packaged modules having metal posts24 Sep 2026US 2026/0293780 A1Skyworks Solutions, Inc.
- Amplifier circuit10 Sep 2026US 2026/0269792 A1Sumitomo Electric Device Innovations, Inc.
- Semiconductor device10 Sep 2026US 2026/0271737 A1Sumitomo Electric Industries, Ltd.
- Rf amplifier devices and methods of manufacturing including modularized designs with flip chip interconnections and integration into packaging6 Aug 2026US 2026/0230051 A1Wolfspeed, Inc.
Most cited
By later US patents
- Power amplifier modules including related systems, devices, and methods66US 9,041,472 B2Skyworks Solutions, Inc. · 2015
- Top feature package and method64US 8,199,518 B1Amkor Technology, Inc. · 2012
- Three dimensional integrated automotive radars and methods of manufacturing the same62US 7,733,265 B2Toyota Motor Engineering & Manufacturing North America, Inc. · 2010
- Integrated circuit adapted for improved thermal impedance55US 5,532,506 ATexas Instruments Incorporated · 1996
- Semiconductor device46US 6,330,165 B1Hitachi, Ltd. · 2001