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US 7,733,265 B2Granted
Three dimensional integrated automotive radars and methods of manufacturing the same
AssigneeToyota Motor Engineering & Manufacturing North America, Inc.
InventorsAlexandros Margomenos, Serdar Hakki Yönak
Life of this patent
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Abstract
The invention is a low-cost, compact radar for adaptively forming beams and independently steering the beams to improve the noise and sensitivity of the radar. The radar includes a printed circuit board, a low-cost multi-layer organic substrate, and a three dimensional (3D) radio frequency (RF) front end that is flood mounted on the substrate.
Claims21
An automotive radar comprising:
- a printed circuit board having a digital signal processor mounted thereon;
- and
- a multi-layer substrate mounted on the printed circuit board, the multi-layer substrate having a plurality of antennas and a transmit/receive module directly connected to the plurality of antennas, wherein the transmit/receive module receives signals from the digital signal processor and uses the signals to form a plurality of beams that are transmitted using the plurality of antennas.
An automotive radar comprising:
- a printed circuit board having an analog-to-digital converter;
- and
- a multi-layer substrate mounted on the printed circuit board, the multi-layer substrate having microstrip patch antennas that receive and transmit beams, a transmit/receive chip connected to the microstrip patch antennas and the analog-to-digital converter, and a phase shifter connected to the analog-to-digital converter to add phase delay to the beams.
An automotive radar comprising:
- a printed circuit board;
- a multi-layer substrate mounted on the printed circuit board, the multi-layer substrate having a plurality of antennas and a SiGe BiCMOS chip directly connected to the plurality of antennas, wherein the SiGe BiCMOS chip is configured to achieve adaptive beam control and beam steering of the plurality of antennas;
- a micro-machined plastic mounted over the transmit/receive module;
- and
- a voltage controlled oscillator integrated on the SiGe BiCMOS chip and ground vias and split grounding planes to isolate noise created by the voltage controlled oscillator.
2 more elements
Dependencies are inferred from the claim text.