Power amplifier modules and systems containing electromagnetic bandgap isolation arrays

A printed circuit board (PCB) utilized within a power amplifier system, the PCB comprising:

• a PCB frontside on which a module mount region is provided;
• a PCB backside located opposite the PCB frontside, as taken in a PCB thickness direction;
• a radio frequency (RF) input bondpad positioned on the PCB frontside and located within an outer peripheral portion of the module mount region;
• an RF output bondpad positioned on the PCB frontside and located within the outer peripheral portion of the module mount region;
• and
• an electromagnetic bandgap (EBG) isolation structure comprising a grounded EBG cell array disposed within the module mount region and configured to reduce electromagnetic coupling between the RF input bondpad and the RF output bondpad.

A power amplifier module (PAM) utilized within a power amplifier system, the PAM comprising:

• a peaking RF power amplifier die;
• a carrier RF power amplifier die;
• a module substrate having a die support surface to which the peaking RF power amplifier die and the carrier RF power amplifier die are attached;
• a molded body bonded to the die support surface, encapsulating the peaking RF power amplifier die and the carrier RF power amplifier die, and at least partially defining a PAM topside surface;
• a topside input/output (I/O) interface formed on the PAM topside surface;
• and
• an EBG isolation structure integrated into the module substrate, the EBG isolation structure comprising:
• an EBG cell array formed in the die support surface at a location between the peaking RF power amplifier die and the carrier RF power amplifier die and extending between respective pairs of topside RF input terminals and topside RF output terminals of the topside I/O interface;
• a ground plane formed in the module substrate at a location beneath the EBG cell array;
• and
• EBG vias extending from the EBG cell array, away from the surface of the die support, and to the ground plane to electrically ground the EBG cell array during operation of the PAM.