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US 5,532,506 AGranted
Integrated circuit adapted for improved thermal impedance
AssigneeTexas Instruments Incorporated
InventorHua Q. Tserng
Life of this patent
Estimating the term…
Abstract
A flip-chip integrated circuit 1100 having a transistor 1108 formed at a frontside surface of a substrate 1104. An airbridge 1106 may be formed over portions of the transistor wherein a top surface of the airbridge is spaced from the frontside surface by a distance approximately equal to, or greater than, the thickness of the substrate. The circuit may also include a transmission line 1114 at the frontside surface and a heatsink 1102 coupled to the airbridge.
Claims13
An integrated circuit, comprising:
- (a) at least one transistor formed at a frontside surface of a substrate;
- (b) at least one transmission line at said frontside surface;
- (c) an airbridge formed over portions of said at least one transistor wherein a top surface of said airbridge is spaced from said frontside surface by a distance approximately equal to, or greater than, the thickness of said substrate;
- (d) a heatsink coupled to said airbridge;
- and
- (e) a conducting via through said substrate coupling said at least one transistor to a bond pad at a backside surface.
3 more elements
An integrated circuit, comprising:
- (a) at least one transistor formed at a frontside surface of a substrate;
- (b) at least one transmission line at said frontside surface;
- (c) an airbridge formed over portions of said at least one transistor wherein a top surface of said airbridge is spaced from said frontside surface by a distance approximately equal to, or greater than, the thickness of said substrate;
- (d) dielectric covering said at least one transmission line such that a surface of said dielectric is substantially planar with said top surface of said airbridge;
- (e) a heatsink coupled to said airbridge;
- and
- (f) a conducting via through said substrate coupling said at least one transistor to a bond pad at said backside surface.
4 more elements
Dependencies are inferred from the claim text.