Top feature package and method

An electronic component package comprising:

• a substrate comprising a first surface;
• an electronic component mounted to the first surface, the electronic component comprising a bond pad;
• a first trace on the first surface electrically connected to the bond pad;
• a package body directly contacting and enclosing the electronic component and the first surface, the package body comprising a principal surface;
• an electrically conductive conformal shield on the package body;
• a shield isolation layer on the conformal shield;
• a conformal top feature layer on the shield isolation layer;
• and
• an embedded interconnect extending through the package body between the first surface and the principal surface and electrically connecting the first trace to the conformal top feature layer.

A method of forming an electronic component package comprising:

• mounting an electronic component to a first surface of a substrate;
• electrically connecting a bond pad of the electronic component to a first trace on the first surface;
• directly contacting and enclosing the electronic component and the first surface in a package body, the package body comprising a principal surface;
• forming an electrically conductive conformal shield on the package body;
• forming a shield isolation layer on the conformal shield;
• forming a conformal top feature layer on the shield isolation layer;
• and
• electrically connecting the first trace to the conformal top feature layer with an embedded interconnect extending through the package body between the first surface and the principal surface.