Semiconductor device

Abstract

A semiconductor device includes a base having an electrical conductivity, a semiconductor chip mounted on the base, the semiconductor chip including a substrate, an amplifier provided at the substrate and configured to amplify a high frequency signal, a reference potential pad provided on an upper surface of the substrate and electrically connected to a reference potential terminal of the amplifier, and a via wiring line penetrating the substrate and electrically connecting the reference potential pad to the base, a first insulating layer provided over the base so as to cover the semiconductor chip, a first wiring layer provided on the first insulating layer, a first through electrode penetrating the first insulating layer and electrically connecting the first wiring layer to the reference potential pad, and a second through electrode penetrating the first insulating layer and electrically connecting the first wiring layer to the base.

Dependencies are inferred from the claim text.