RF package and method of manufacture of an RF package

An antenna-in-package comprising:

• a radio frequency (RF) package assembly that includes a stacked arrangement of a first substrate and
• a second substrate, wherein
• the first substrate has a first substrate interface layer which includes
• a plurality of first substrate RF signal pads configured to transmit or receive an RF signal,
• a plurality of first substrate ground pads, and
• an antenna array layer comprising an array of patch antennas, wherein the plurality of first substrate RF signal pads are coupled to respective patch antennas of the array of patch antennas;
• the second substrate has a second substrate interface layer which includes
• a plurality of second substrate RF signal pads configured to transmit or receive an RF signal, and
• a plurality of second substrate ground pads;
• and
• the RF package assembly further includes an interface region between the first substrate and the second substrate, wherein the interface region includes
• additional metal regions on at least one of the plurality of first substrate RF signal pads and the plurality of second substrate RF signal pads,
• a plurality of galvanic connection regions providing a galvanic connection between the plurality of first substrate ground pads and the plurality of second substrate ground pads, and
• a plurality of dielectric regions in a plurality of gaps between the plurality of first substrate RF signal pads and the plurality of second substrate RF signal pads.

A method of manufacturing an RF package assembly comprising a stacked arrangement of a first substrate and a second substrate, the method comprising:

• providing the first substrate having a first substrate interface layer that includes
• a plurality of first substrate RF signal pads configured to transmit or receive an RF signal, and
• a plurality of first substrate ground pads;
• providing the second substrate having a second substrate interface layer that includes
• a plurality of second substrate RF signal pads, and
• a plurality of second substrate ground pads;
• and
• forming an interface region between the first substrate and the second substrate by
• forming additional metal regions on at least one of the plurality of first substrate RF signal pads and the plurality of second substrate RF signal pads,
• forming a plurality of galvanic connection regions connecting the plurality of first substrate ground pads and the plurality of second substrate ground pads, and
• forming a plurality of dielectric regions in a plurality of gaps between the plurality of first substrate RF signal pads and the plurality of second substrate RF signal pads.

An antenna-in-package package assembly comprising a stacked arrangement of a first substrate and a second substrate, wherein:

• the first substrate includes
• an antenna array layer with a patch antenna, and
• a first substrate interface layer which includes
• a first substrate RF signal pad coupled to the patch antenna, and
• a first substrate ground pad;
• the second substrate includes
• a second substrate interface layer which includes
• a second substrate RF signal pad, and
• a second substrate ground pad;
• and
• the antenna-in-package package assembly further includes
• at least one additional metal region on at least one of the first substrate RF signal pad and the second substrate RF signal pad, and
• an interface region between the first substrate and the second substrate, the interface region configured and arranged to galvanically connect the first substrate ground pad to the second substrate ground pad, and further configured to capacitively couple an RF signal transmitted between the first substrate and the second substrate across a plurality of gaps between the first substrate RF signal pad and the second substrate RF signal pad.