Leadless plastic chip carrier with etch back pad singulation and die attach pad array
AssigneeASAT Ltd.
InventorsKin Pui Kwan, Wing Him Lau, Kwok Cheung Tsang, Chun Ho Fan, Neil Mclellan
Life of this patent
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Abstract
A leadless plastic chip carrier has a plurality of die attach pads on which a singulated semi-conductor die is mounted. At least one row of contact pads circumscribes the plurality of die attach pads and a power/ground ring is intermediate the contact pads and the die attach pads. Wire bonds connect the semiconductor die, the contact pads and the power/ground ring. An overmold covers the semiconductor die, the die attach pads, the power/ground ring and the contact pads such that each of the die attach pads and the contact pads has one exposed surface.
Claims13
A leadless plastic chip carrier comprising:
- a plurality of die attach pads;
- a semiconductor die mounted to said plurality of die attach pads;
- at least one row of contact pads circumscribing said plurality of die attach pads;
- a power/ground ring intermediate said at least one row of contact pads and said ground plane;
- a plurality of wire bonds connecting various ones of said semiconductor die, said contact pads and said power/ground ring;
- and
- an overmold covering said semiconductor die, said plurality of die attach pads, said power/ground ring and said contact pads such that each of said die attach pads and said contact pads has one exposed surface.
Dependencies are inferred from the claim text.