Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems

A device, comprising:

• a package substrate having a top side above a bottom side, a first sidewall between the top side and the bottom side, and a second sidewall between the top side and the bottom side, the second sidewall laterally opposite the first sidewall;
• a mold material having a top side and a bottom side, a first sidewall between the top side and the bottom side, and a second sidewall between the top side and the bottom side, the second sidewall laterally opposite the first sidewall, wherein the bottom side of the mold material is on the top side of the package substrate, wherein the first sidewall of the mold material is co-planar with the first sidewall of the package substrate, and wherein the second sidewall of the mold material is co-planar with the second sidewall of the package substrate;
• a die having a top side above a bottom side, a first sidewall between the top side and the bottom side, and a second sidewall between the top side and the bottom side, the second sidewall laterally opposite the first sidewall, wherein the bottom side of the die is coupled to the top side of the package substrate, and wherein the die is embedded in the mold material;
• a conductive layer on the top side of the mold material, the conductive layer over the die;
• a first through mold conductive connection extending from the top side of the package substrate to the conductive layer, the first through mold conductive connection laterally adjacent to the first sidewall of the die;
• and
• a second through mold conductive connection extending from the top side of the package substrate to the conductive layer, the second through mold conductive connection laterally adjacent to the second sidewall of the die.