H10W 44/241
For passive devices or passive elements
Official title: {for passive devices or passive elements}
H10W44/241 (For passive devices or passive elements) appears on 3,280 US grants and 3,885 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,280
- Published applications
- 3,885
- Assignees
- 679
- Inventors
- 5,052
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 4 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 5 | 0 |
| 2001 | 10 | 4 |
| 2002 | 9 | 17 |
| 2003 | 10 | 14 |
| 2004 | 16 | 19 |
| 2005 | 21 | 36 |
| 2006 | 27 | 42 |
| 2007 | 24 | 67 |
| 2008 | 27 | 84 |
| 2009 | 48 | 97 |
| 2010 | 70 | 98 |
| 2011 | 76 | 108 |
| 2012 | 95 | 119 |
| 2013 | 112 | 128 |
| 2014 | 107 | 158 |
| 2015 | 128 | 144 |
| 2016 | 178 | 166 |
| 2017 | 201 | 225 |
| 2018 | 196 | 257 |
| 2019 | 251 | 322 |
| 2020 | 279 | 379 |
| 2021 | 273 | 336 |
| 2022 | 299 | 288 |
| 2023 | 231 | 276 |
| 2024 | 225 | 217 |
| 2025 | 211 | 183 |
| 2026 | 136 | 101 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Photosensitive resin composition, cured film, electronic component, antenna element, semiconductor package, and compound29 Sep 2026US 12,747,202 B2Toray Industries, Inc.
- Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems22 Sep 2026US 12,744,322 B2Intel Corporation
- Integrated circuit packages and methods of forming the same22 Sep 2026US 12,745,645 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices22 Sep 2026US 12,745,646 B2Amkor Technology Singapore Holding Pte.Ltd.
- Encapsulation techniques22 Sep 2026US 12,745,670 B2Elta Systems Ltd.
- Mesh inductors and antennas of electronic assemblies8 Oct 2026US 2026/0314395 A1Super Micro Computer, Inc.
- Integrated circuit packages and methods of forming the same8 Oct 2026US 2026/0314429 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package including antenna substrate and manufacturing method thereof1 Oct 2026US 2026/0302594 A1Advanced Semiconductor Engineering, Inc.
- Heterogeneous antenna in fan-out package1 Oct 2026US 2026/0302595 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems1 Oct 2026US 2026/0302626 A1Intel Foundry IP LLC
Most cited
By later US patents
- Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system387US 7,619,901 B2EPIC Technologies, Inc. · 2009
- Tamper-resistant wireless article including an antenna310US 6,421,013 B1Amerasia International Technology, Inc. · 2002
- Vertical system integration289US 7,402,897 B2Elm Technology Corporation · 2008
- Signal delivery in stacked device289US 8,106,520 B2Micron Technology, Inc. · 2012
- System with chip to chip communication261US 5,621,913 AMicron Technology, Inc. · 1997