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US 2026/0302594 A1Published application
Semiconductor package including antenna substrate and manufacturing method thereof
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorHan-Chee YEN
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes: (1) a package substrate including an upper surface; (2) a semiconductor device disposed adjacent to the upper surface of the package substrate, the semiconductor device including an inactive surface; and (3) an antenna substrate disposed on the inactive surface of the semiconductor device.
Claims20
A semiconductor package comprising:
- a circuit structure;
- an electronic component disposed adjacent to the circuit structure;
- an antenna substrate disposed adjacent to the circuit structure;
- and
- a ground potential layer closer to the circuit structure than the antenna substrate.
2 more elements
A semiconductor package comprising:
- a package substrate;
- an antenna substrate disposed adjacent to the package substrate;
- and
- a spacer disposed between the package substrate and the antenna substrate and configured to transmit an RF signal between the package substrate and the antenna substrate.
1 more element
Dependencies are inferred from the claim text.