System with chip to chip communication

A single electronic component comprising:

• a plurality of semiconductor chips which transfer data among each other, wherein each chips includes a transceiver, and wherein the transceiver of each chip includes
• a transmitter for modulating a radio frequency (RF) signal with data and for transmitting the modulated RF signal in a radiation pattern which encompasses each of the chips;
• and
• a receiver for receiving the respective modulated RF signal from the transmitter of each of the other chips, independent of the physical alignment between each two chips within said plurality of chips, wherein the received signals are received through RF wave propagation through space rather than through physical connection between the chips of the single electronic component.

An single electrical circuit comprising:

• (a) a first semiconductor chip comprising:
• (1) a first circuit for providing a first signal conveying information;
• and
• (2) a first transmitter for broadcasting information conveyed by the first signal;
• and
• (b) a second semiconductor chip comprising:
• (1) a first receiver for receiving the transmitted information, without any physical connection to the first semiconductor chip and independent of any alignment between the first semiconductor chip and the second semiconductor chip and for providing a second signal conveying the transmitted information;
• and
• (2) a second circuit responsive to the second signal;
• and
• (c) a first metal enclosure, surrounding the first semiconductor chip and the second semiconductor chip, for maintaining communication between the first transmitter and the first receiver of the single electrical circuit.

An single electrical circuit having a plurality of semiconductor chips which transfer data among each other, comprising:

• said plurality of semiconductor chips, wherein
• each chip includes a transmitter for modulating a radio frequency (RF) signal with data and for transmitting the modulated RF signal in a radiation pattern which encompasses each of the chips, and
• each chip includes a receiver for receiving the respective modulated RF signal from the transmitter of each of the other chips, independent of the physical alignment between each two chips within said plurality of chips, wherein the received signals are received through RF wave propagation through space rather than through physical connection between the chips;
• and
• a metal enclosure, surrounding all of the chips, for maintaining communication among the chips of the single electrical circuit.

A method of manufacturing an single electronic component, comprising the steps of:

• providing an enclosure composed of electrically conductive material;
• and
• mounting within the enclosure a plurality of semiconductor chips, wherein each chip includes an RF transceiver for transmitting data to, and receiving data from, the other chips independent of the physical alignment between each two chips within said plurality of chips, and wherein the chips are mounted without any physical connectors between the chips for transferring said data;
• whereby the electrically conductive enclosure maintains communication among the chips of the single electronic component.