H10W 44/251
For monolithic microwave integrated circuits [mmic]
Official title: {for monolithic microwave integrated circuits [MMIC]}
H10W44/251 (For monolithic microwave integrated circuits [mmic]) appears on 407 US grants and 429 published applications in this corpus.
Search patents in H10W- Granted patents
- 407
- Published applications
- 429
- Assignees
- 135
- Inventors
- 847
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 2 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 1 |
| 2005 | 1 | 0 |
| 2006 | 1 | 0 |
| 2007 | 0 | 2 |
| 2008 | 0 | 0 |
| 2009 | 1 | 1 |
| 2010 | 0 | 2 |
| 2011 | 0 | 2 |
| 2012 | 4 | 15 |
| 2013 | 15 | 22 |
| 2014 | 12 | 12 |
| 2015 | 19 | 23 |
| 2016 | 39 | 25 |
| 2017 | 29 | 35 |
| 2018 | 32 | 28 |
| 2019 | 36 | 46 |
| 2020 | 31 | 45 |
| 2021 | 30 | 48 |
| 2022 | 41 | 43 |
| 2023 | 39 | 28 |
| 2024 | 31 | 21 |
| 2025 | 22 | 15 |
| 2026 | 8 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- RF amplifier devices and methods of manufacturing including modularized designs with flip chip interconnections and integration into packaging2 Jun 2026US 12,647,083 B2Wolfspeed, Inc.
- Package dies including vertical interconnects for signal and power distribution in a three-dimensional (3D) integrated circuit (IC) package12 May 2026US 12,628,354 B2QUALCOMM Incorporated
- Hybrid planar combiner for planar solid state power amplifiers14 Apr 2026US 12,603,410 B2Aselsan Elektronik Sanayi Ve Ticaret Anonim Sirketi
- Microwave integrated circuits including gallium-nitride devices on silicon17 Mar 2026US 12,581,728 B2MACOM Technology Solutions Holdings, Inc.
- Microwave device having a conductive heat spreader and antenna having microwave device17 Mar 2026US 12,581,953 B2Mitsubishi Electric Corporation
- Rf amplifier devices and methods of manufacturing including modularized designs with flip chip interconnections and integration into packaging6 Aug 2026US 2026/0230051 A1Wolfspeed, Inc.
- Amplifier Circuit Having a Coil Structure with Mutually Inductively Coupled Coils30 Jul 2026US 2026/0221949 A1Infineon Technologies AG
- Microwave device having a conductive heat spreader and antenna having microwave device25 Jun 2026US 2026/0182385 A1Mitsubishi Electric Corporation
- Monolithic microwave integrated circuit with thermally dissipative interposer25 Jun 2026US 2026/0182406 A1Qorvo US, Inc.
- Monolothic microwave integrated circuit with thermally conductive pocketed interposer25 Jun 2026US 2026/0182417 A1Qorvo US, Inc.
Most cited
By later US patents
- Three-dimensional microwave circuit carrier and integral waveguide coupler226US 5,045,820 AMotorola, Inc. · 1991
- On-chip power-combining for high-power schottky diode based frequency multipliers193US 9,143,084 B2California Institute of Technology · 2015
- Monolithic microwave integrated circuit and method112US 5,528,209 AHughes Aircraft Company · 1996
- Direct backside interconnect for multiple chip assemblies90US 6,175,287 B1Raytheon Company · 2001
- Conductively enclosed hybrid integrated circuit assembly using a silicon substrate77US 5,049,978 AGeneral Electric Company · 1991