Monolithic microwave integrated circuit with thermally dissipative interposer

A method for packaging a monolithic microwave integrated circuit (MMIC), the method comprising:

• providing a MMIC die comprising:
• an active circuit layer;
• a first substrate material;
• at least one conductive through-semiconductor via (TSV) extending completely through the first substrate material from a top side to a bottom side of the MMIC die;
• providing a thermally dissipative interposer comprising:
• a second substrate material different from the first substrate material and electrically insulating at an operating voltage of the MMIC die;
• and
• at least one conductive via, pad, or trace;
• and
• bonding the MMIC die to the thermally dissipative interposer such that the at least one conductive via, pad, or trace is in electrical contact with the at least one conductive TSV or the active circuit layer.

A wireless device comprising:

• a monolithic microwave integrated circuit (MMIC) device, comprising:
• a MMIC die comprising:
• an active circuit layer;
• a first substrate material;
• at least one conductive through-semiconductor via (TSV) extending completely through the first substrate material from a top side to a bottom side of the MMIC die;
• a thermally dissipative interposer comprising:
• a second substrate material different from the first substrate material and electrically insulating at an operating voltage of the MMIC die;
• and
• at least one conductive via, pad, or trace in electrical contact with the at least one conductive TSV or the active circuit layer.