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AssigneeMotorola, Inc.
InventorsJohn L. Leicht, Hugh R. Malone, Douglas J. Mathews, James E. Mitzlaff, Scott D. Munier, Michele G. Oehlerking, Vernon R. Scott
Estimating the term…
A non-hermetic, three-dimensional, microwave semiconductor device carrier with integral waveguide couplers is disclosed. A molded plastic substrate having a suitable dielectric constant and varying thicknesses comprises plated conductors and locations for receiving GaAs MMIC's. MMIC's are mounted to a metal backplate and die bonded to the plated conductors. The waveguide couplers are integrally molded as part of the carrier substrate, and comprise plated through cylindrical members. Signals from a waveguide cavity are coupled to the MMIC's by inserting the waveguide couplers into a waveguide port. The carrier and integral waveguide coupler together with a plated molded cover forms a non-hermetic package providing pseudo-shielding cavities about the resident multiple semiconductor GaAs die. Transmission line impedance control is enhanced varying the substrate thickness on a per conductor basis. Frequency of operation exceeds 12 gigahertz.
A microwave circuit carrier, comprising:
A microwave circuit carrier, comprising:
A microwave circuit module, comprising:
Dependencies are inferred from the claim text.