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US 12,603,410 B2Granted
Hybrid planar combiner for planar solid state power amplifiers
AssigneeAselsan Elektronik Sanayi Ve Ticaret Anonim Sirketi
InventorsAhmet Aktug, Ridvan Surbahanli
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Abstract
A hybrid planar combiner for use in broadband high power multi-component power amplifier architectures in planar solid-state power amplifiers, which does not comprise impedance converters in the power amplifier layer, is suitable for hermetic construction, supports effective cooling infrastructure and enables easy in-circuit applications.
Claims3
A hybrid planar combiner configured to use multiple planar solid-state power amplifiers for use in broadband high power multi-component power amplifier architectures, the hybrid planar combiner comprising:
- at least one signal divider configured to send the signal to be amplified to more than one line of the multiple planar solid-state power amplifiers;
- the multiple planar solid-state power amplifiers disposed on a planar solid-state power amplifier surface and configured to amplify signals from the signal divider;
- a signal combiner configured to be connected at a single common node at one end to the outputs of the power amplifiers, wherein all outputs of the power amplifiers are positioned adjacent to each other and connected to the single common node, and the signal combiner being vertically separated from the planar solid-state power amplifier surface such that the combined output is extracted vertically to the plane of the power amplifiers;
- and
- a waveguide configured to drop impedance in the signal combiner;
- wherein the signal combiner is configured to ensure that an impedance value is maintained at the desired level by transferring the impedance matching to a waveguide input and wherein the output impedance Z0 observed at the outputs of the identical power amplifiers connected to each other is reduced to Z0/n value by the waveguide, where the n is the number of power amplifiers.
3 more elements
Dependencies are inferred from the claim text.