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H10W 44/203

Electrical connections

Official title: {Electrical connections}

H10W44/203 (Electrical connections) appears on 2,957 US grants and 3,195 published applications in this corpus.

Search patents in H10W

Granted patents: 2,957
Published applications: 3,195
Assignees: 704
Inventors: 5,138
Latest grant: 6 Oct 2026

Filings by year

H10W 44/203: granted patents and published applications per publication year
Year	Granted patents	Published applications
1977	1	0
1978	0	0
1979	0	0
1980	1	0
1981	1	0
1982	0	0
1983	1	0
1984	2	0
1985	2	0
1986	3	0
1987	5	0
1988	5	0
1989	5	0
1990	4	0
1991	9	0
1992	10	0
1993	5	0
1994	10	0
1995	18	0
1996	17	0
1997	19	0
1998	18	0
1999	22	0
2000	23	0
2001	40	17
2002	59	77
2003	68	77
2004	60	70
2005	59	83
2006	72	82
2007	52	100
2008	61	64
2009	55	105
2010	76	82
2011	82	79
2012	91	93
2013	79	83
2014	82	108
2015	98	109
2016	144	134
2017	147	143
2018	164	158
2019	162	196
2020	177	238
2021	156	216
2022	187	211
2023	157	234
2024	171	186
2025	170	134
2026	107	116

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

Subgroups

Granted patents

Recent patents

Power amplifier and radio frequency module6 Oct 2026US 12,756,368 B2Mitsubishi Electric Corporation
Package substrate with open air gap structures6 Oct 2026US 12,757,739 B2Intel Corporation
Package structure with transmission line and method for manufacturing the same29 Sep 2026US 12,751,293 B2Taiwan Semiconductor Manufacturing Company.Ltd
Integrated circuit packages and methods of forming the same22 Sep 2026US 12,745,645 B2Taiwan Semiconductor Manufacturing Company.Ltd
Package on package semiconductor device with integrated antenna and method therefor15 Sep 2026US 12,738,634 B2NXP USA, Inc.

Most cited

By later US patents