H10W 44/223
Differential pair signal lines
Official title: {Differential pair signal lines}
H10W44/223 (Differential pair signal lines) appears on 181 US grants and 216 published applications in this corpus.
Search patents in H10W- Granted patents
- 181
- Published applications
- 216
- Assignees
- 116
- Inventors
- 510
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 3 |
| 2004 | 3 | 3 |
| 2005 | 2 | 3 |
| 2006 | 1 | 3 |
| 2007 | 3 | 18 |
| 2008 | 8 | 7 |
| 2009 | 4 | 5 |
| 2010 | 5 | 6 |
| 2011 | 7 | 12 |
| 2012 | 7 | 5 |
| 2013 | 7 | 4 |
| 2014 | 8 | 5 |
| 2015 | 5 | 8 |
| 2016 | 10 | 7 |
| 2017 | 15 | 11 |
| 2018 | 9 | 6 |
| 2019 | 8 | 19 |
| 2020 | 12 | 16 |
| 2021 | 7 | 12 |
| 2022 | 14 | 18 |
| 2023 | 10 | 16 |
| 2024 | 13 | 10 |
| 2025 | 11 | 3 |
| 2026 | 9 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Balun phase and amplitude imbalance correction4 Aug 2026US 12,700,843 B2Texas Instruments Incorporated
- Semiconductor package, base station, mobile device and method for forming a semiconductor package26 May 2026US 12,642,103 B2Intel Corporation
- Semiconductor package having ordered wire arrangement between differential pair connection pads5 May 2026US 12,622,322 B2SK hynix Inc.
- Chip packaging apparatus and terminal device31 Mar 2026US 12,593,644 B2Huawei Technologies Co., Ltd.
- Wiring board and semiconductor package10 Mar 2026US 12,575,423 B2Samsung Electronics Co., Ltd.
- Vertical balun for differential-to-single ended transition of mm-wave signals1 Oct 2026US 2026/0305361 A1NXP B. V.
- High-speed signal stabilization in a common substrate24 Sep 2026US 2026/0293693 A1Micron Technology, Inc.
- Marchand baluns in package substrates3 Sep 2026US 2026/0262503 A1
- Semiconductor package2 Jul 2026US 2026/0191015 A1Elspes Inc.
- Semiconductor package2 Jul 2026US 2026/0191016 A1Elspes Inc.
Most cited
By later US patents
- Semiconductor package substrate59US 7,732,913 B2Siliconware Precision Industries Co., Ltd. · 2010
- Ball grid array package-to-board interconnect co-design apparatus51US 7,405,477 B1Altera Corporation · 2008
- Multilayer printed circuit board for high-speed differential signal, communication apparatus, and data storage apparatus41US 7,448,880 B2Hitachi, Ltd. · 2008
- Horizontally twisted-pair planar conductor line structure30US 5,397,862 AMotorola, Inc. · 1995
- Multi-layered integrated circuit package with improved high frequency performance27US 5,338,970 AIntergraph Corporation · 1994