Multi-layered integrated circuit package with improved high frequency performance

An improved multi-layered integrated circuit package comprising:

• a plurality of interleaved layers of conductive material and dielectric material sandwiched between a top plate and a bottom plate, and surrounding a die-attach area of predetermined size;
• an array of external connectors extending from said bottom plate of the package;
• and
• a plurality of via columns electrically connecting each external connector of said array of external connectors to a predetermined horizontal path on a selected layer of conductive material,
• wherein, said plurality of layers of conductive material connect, through corresponding ones of said plurality of via columns and external connectors, to shield signals and active signals in an alternating fashion.

An improved multi-layered integrated circuit package having a plurality of interleaved layers of conductive material and dielectric material sandwiched between a top plate and a bottom plate, and surrounding a die-attach area of predetermined size, the package comprising:

• an array of external connectors, extending from the bottom plate and spaced apart at a predetermined dimension;
• a first plurality of via columns spaced apart at said predetermined dimension and electrically connecting each external connector of said array of external connectors to a predetermined horizontal path on a selected layer of conductive material;
• and
• at least one parallel via column disposed adjacent to one of said first plurality of via columns at a prescribed distance less tan said predetermined dimension, wherein said prescribed distance provides for electromagnetic coupling between said at least one parallel via column and said one of said first plurality of via columns to form a two-wire transmission line;
• and
• a plurality of bond wires connecting electrical paths in the layers of conductive material to a semiconductor chip mounted on the die-attach area, wherein bond wires carrying power are placed adjacent to bond wires carrying ground in an alternating fashion.