Chip packaging apparatus and terminal device
AssigneeHuawei Technologies Co., Ltd.
InventorsChao Ma, Yan Li, Wenkai Fan, Shujie Cai
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AssigneeHuawei Technologies Co., Ltd.
InventorsChao Ma, Yan Li, Wenkai Fan, Shujie Cai
Estimating the term…
A chip packaging apparatus includes a first differential pin pair, a first pin, and a second pin. The first differential pin pair includes a first differential signal pin and a second differential signal pin. In addition, the first pin and the second pin are both located between the first differential signal pin and the second differential signal pin, and the first pin and the second pin are differential signal pins (or both are power pins). The first pin is adjacent to the first differential signal pin and the second differential signal pin. The second pin is adjacent to the first differential signal pin and the second differential signal pin. The first pin and the second pin are respectively located on two sides of a first imaginary straight line connecting the first differential signal pin to the second differential signal pin.
A chip packaging apparatus, comprising:
A chip packaging apparatus, comprising:
Dependencies are inferred from the claim text.