Semiconductor package

Abstract

The present invention relates to a semiconductor package. The semiconductor package of the present invention includes a package substrate, a first semiconductor die disposed on the package substrate, a second semiconductor die disposed on the package substrate to be spaced apart from the first semiconductor die, and at least one pair of differential channels connected to the first semiconductor die and the second semiconductor die, wherein the at least one pair of differential channels include at least one first differential channel and at least one second differential channel, each of which transmits a signal with a different phase, the at least one first differential channel includes a first capacitor, the at least one second differential channel includes a second capacitor, and each of the first capacitor and the second capacitor includes a first pad or bump connected to the first semiconductor die and a second pad or bump connected to the second semiconductor die, and the semiconductor package may reduce electrical non-uniformity between differential channels and ensure the symmetry and stability of differential signals by including alternating current (AC) coupling capacitors disposed in each differential channel.

Dependencies are inferred from the claim text.