Semiconductor package having ordered wire arrangement between differential pair connection pads

A semiconductor package comprising:

• a package substrate;
• a first semiconductor chip disposed on the package substrate and wire-bonded to the package substrate;
• and
• a second semiconductor chip stacked on the first semiconductor chip and wire-bonded to the package substrate,
• wherein the first semiconductor chip includes first differential pair signal pads, a first option signal pad disposed adjacent to the first differential pair signal pads, and a first signal path control circuit for controlling signal input/output of the first differential pair signal pads and the first option signal pad,
• wherein the second semiconductor chip includes second differential pair signal pads, a second option signal pad disposed adjacent to the second differential pair signal pads, and a second signal path control circuit for controlling signal input/output of the second differential pair signal pads and the second option signal pad,
• wherein the first signal path control circuit is configured to change a signal path of one of differential pair signals of the first semiconductor chip by a first control signal, and a pad to which the one of the differential pair signals reaches is changed from one of the first differential pair signal pads to the first option signal pad, along the changed signal path,
• wherein according to the changed signal path of the first semiconductor chip, the first option signal pad outputs the one of the differential pair signals of the first semiconductor chip into the package substrate through a first signal wire,
• wherein the second signal path control circuit is configured to change a signal path of one of differential pair signals of the second semiconductor chip by a second control signal, and a pad to which the one of the differential pair signals reaches is changed from one of the second differential pair signal pads to the second option signal pad, along the changed signal path, and
• wherein according to the changed signal path of the second semiconductor chip, the second option signal pad outputs the one of the differential pair signals of the second semiconductor chip into the package substrate through a second signal wire.