Semiconductor package

Abstract

The present invention relates to a semiconductor package. The semiconductor package of the present invention includes a package substrate, a first semiconductor die disposed on the package substrate, a second semiconductor die disposed on the package substrate to be spaced apart from the first semiconductor die, and at least one capacitor disposed on at least one electrical path between the first semiconductor die and the second semiconductor die, wherein the at least one capacitor includes a first pad or bump connected to the first semiconductor die and a second pad or bump connected to the second semiconductor die, and alternating current (AC)-couples the first semiconductor die and the second semiconductor die, thereby enhancing electromagnetic interference (EMI) shielding performance of chip-to-chip communication and improving signal integrity.

Dependencies are inferred from the claim text.