Package on package semiconductor device with integrated antenna and method therefor

A semiconductor device comprising:

• a package substrate including a waveguide formed through the package substrate;
• an antenna sub-assembly mounted on a first major side of the package substrate, the antenna sub-assembly comprising:
• an antenna substrate;
• an antenna substrate waveguide formed through a core portion of the antenna substrate, the antenna substrate waveguide aligned with the waveguide formed through the package substrate;
• and
• an antenna structure aligned with the antenna substrate waveguide;
• and
• a packaged radio frequency (RF) semiconductor device mounted on a second major side of the package substrate, the packaged RF semiconductor device comprising:
• a first semiconductor die,
• a first encapsulant encapsulating the first semiconductor die, and
• a redistribution layer (RDL) formed over an active side of the first semiconductor die, a signal launcher formed from a conductive layer of the RDL and configured for propagation of an RF signal through the waveguide formed through the package substrate.

A method comprising:

• mounting an antenna sub-assembly on a first major side of a package substrate, the antenna sub-assembly comprising:
• an antenna substrate;
• an antenna substrate waveguide formed through a core portion of the antenna substrate, the antenna substrate waveguide aligned with a waveguide formed through the package substrate;
• and
• an antenna structure aligned with the antenna substrate waveguide;
• and
• mounting a packaged radio frequency (RF) semiconductor device on a second major side of the package substrate, the packaged RF semiconductor device comprising:
• a first semiconductor die,
• a first encapsulant encapsulating the first semiconductor die, and
• a redistribution layer (RDL) formed over an active side of the first semiconductor die, a signal launcher formed from a conductive layer of the RDL and configured for propagation of an RF signal through the waveguide formed through the package substrate.