H10W 44/209
Vertical interconnections
Official title: {Vertical interconnections, e.g. vias}
H10W44/209 (Vertical interconnections) appears on 1,059 US grants and 1,196 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,059
- Published applications
- 1,196
- Assignees
- 333
- Inventors
- 2,238
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 6 | 0 |
| 1993 | 0 | 0 |
| 1994 | 5 | 0 |
| 1995 | 4 | 0 |
| 1996 | 4 | 0 |
| 1997 | 5 | 0 |
| 1998 | 5 | 0 |
| 1999 | 5 | 0 |
| 2000 | 8 | 0 |
| 2001 | 16 | 8 |
| 2002 | 24 | 31 |
| 2003 | 23 | 29 |
| 2004 | 28 | 19 |
| 2005 | 16 | 23 |
| 2006 | 28 | 34 |
| 2007 | 18 | 34 |
| 2008 | 14 | 17 |
| 2009 | 16 | 21 |
| 2010 | 22 | 28 |
| 2011 | 35 | 31 |
| 2012 | 23 | 23 |
| 2013 | 19 | 22 |
| 2014 | 19 | 30 |
| 2015 | 29 | 37 |
| 2016 | 46 | 37 |
| 2017 | 48 | 45 |
| 2018 | 50 | 65 |
| 2019 | 60 | 78 |
| 2020 | 67 | 93 |
| 2021 | 69 | 82 |
| 2022 | 50 | 82 |
| 2023 | 65 | 117 |
| 2024 | 70 | 81 |
| 2025 | 79 | 74 |
| 2026 | 66 | 55 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Package substrate with open air gap structures6 Oct 2026US 12,757,739 B2Intel Corporation
- Package structure with transmission line and method for manufacturing the same29 Sep 2026US 12,751,293 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit packages and methods of forming the same22 Sep 2026US 12,745,645 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Power amplifier device having dies with elongated bondpads connected through a device substrate15 Sep 2026US 12,738,906 B2NXP USA, Inc.
- Power amplifier modules and systems containing electromagnetic bandgap isolation arrays25 Aug 2026US 12,720,668 B2NXP USA, Inc.
- Integrated circuit packages and methods of forming the same8 Oct 2026US 2026/0314429 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Heterogeneous antenna in fan-out package1 Oct 2026US 2026/0302595 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Custom rf inductors for rf modules24 Sep 2026US 2026/0293692 A1Qorvo US, Inc.
- Devices and methods related to packaged modules having metal posts24 Sep 2026US 2026/0293780 A1Skyworks Solutions, Inc.
- Electronic device17 Sep 2026US 2026/0282934 A1Advanced Semiconductor Engineering, Inc.
Most cited
By later US patents
- Integrated antenna for RFIC package applications159US 8,988,299 B2International Business Machines Corporation · 2015
- Cavity packages150US 10,923,408 B2Invensas Bonding Technologies, Inc. · 2021
- Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same138US 6,498,381 B2Tru-Si Technologies, Inc. · 2002
- Multi-layer single substrate microwave transmit/receive module131US 4,967,201 AWestinghouse Electric Corp. · 1990
- Micro-coaxial substrate112US 4,673,904 AITT Corporation · 1987