Custom rf inductors for rf modules
AssigneeQorvo US, Inc.
InventorsVladimir Kolchuzhin, Andriy Kryshtopin, Loizos Loizou
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AssigneeQorvo US, Inc.
InventorsVladimir Kolchuzhin, Andriy Kryshtopin, Loizos Loizou
Estimating the term…
Disclosed herein are embodiments of a radio frequency (RF) package that include a package laminate and a surface mount device mounted to a mounting surface of the package laminate. The package laminate includes a first laminate substrate and a metallic structure integrated with the first laminate substrate. An electronic component is mounted to the mounting surface of the first laminate substrate. The surface mount device includes a second laminate substrate and an inductor integrated with the second laminate substrate. A bounded physical area is defined by at least one of a surface of the electronic component and the metallic structure that defines a boundary of the bounded physical area. The surface mount device is dimensioned so as to fit within the bounded physical area. In this manner, the surface mount device allows for a more compact RF package with a higher quality factor.
A radio frequency (RF) package, comprising:
A method of manufacturing a radio frequency (RF) package, comprising:
A user element comprising a radio frequency (RF) package, the RF package comprising:
A method of designing a surface mount device, the method comprising:
Dependencies are inferred from the claim text.