H10W 44/212
Coaxial feed-throughs in substrates
Official title: {Coaxial feed-throughs in substrates}
H10W44/212 (Coaxial feed-throughs in substrates) appears on 357 US grants and 342 published applications in this corpus.
Search patents in H10W- Granted patents
- 357
- Published applications
- 342
- Assignees
- 174
- Inventors
- 742
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 5 | 0 |
| 1993 | 0 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 5 | 0 |
| 1999 | 3 | 0 |
| 2000 | 5 | 0 |
| 2001 | 12 | 7 |
| 2002 | 19 | 27 |
| 2003 | 18 | 21 |
| 2004 | 19 | 16 |
| 2005 | 9 | 11 |
| 2006 | 21 | 26 |
| 2007 | 9 | 22 |
| 2008 | 8 | 11 |
| 2009 | 14 | 11 |
| 2010 | 9 | 15 |
| 2011 | 23 | 18 |
| 2012 | 12 | 9 |
| 2013 | 11 | 6 |
| 2014 | 10 | 10 |
| 2015 | 14 | 11 |
| 2016 | 11 | 8 |
| 2017 | 10 | 4 |
| 2018 | 4 | 8 |
| 2019 | 7 | 7 |
| 2020 | 9 | 7 |
| 2021 | 6 | 11 |
| 2022 | 10 | 16 |
| 2023 | 7 | 26 |
| 2024 | 10 | 13 |
| 2025 | 14 | 10 |
| 2026 | 14 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Via micro-modules for through mold via replacement25 Aug 2026US 12,721,192 B2Intel Corporation
- Power architecture with dual core advance substrate4 Aug 2026US 12,702,073 B2APPLIED Materials.Inc.
- Flip-chip ball grid array-type integrated circuit package for very high frequency operation14 Jul 2026US 12,685,175 B2Teledyne E2V Semiconductors SAS
- Semiconductor package, base station, mobile device and method for forming a semiconductor package26 May 2026US 12,642,103 B2Intel Corporation
- Semiconductor package, semiconductor module, semiconductor device, and semiconductor package manufacturing method20 Aug 2026US 2026/0247982 A1Sony Semiconductor Solutions Corporation
- Conveying radio frequency signals through an interposer30 Jul 2026US 2026/0223686 A1NXP USA, Inc.
- Semiconductor device and semiconductor package comprising same25 Jun 2026US 2026/0182439 A1Electronics and Telecommunications Research Institute
- Wiring board and semiconductor package18 Jun 2026US 2026/0173892 A1Samsung Electronics Co., Ltd.
- Chip, chip manufacturing method, computing device, and signal transmission method28 May 2026US 2026/0150737 A1Huawei Technologies Co., Ltd.
Most cited
By later US patents
- Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same138US 6,498,381 B2Tru-Si Technologies, Inc. · 2002
- Multi-layer single substrate microwave transmit/receive module131US 4,967,201 AWestinghouse Electric Corp. · 1990
- Micro-coaxial substrate112US 4,673,904 AITT Corporation · 1987
- Integrated circuit package including pin and barrel interconnects111US 6,476,476 B1Amkor Technology, Inc. · 2002
- Vias and method for making the same in organic board and chip carriers110US 5,949,030 AInternational Business Machines Corporation · 1999