Wiring board and semiconductor package

A semiconductor package comprising:

• a wiring board including at least one pair of signal transmission lines disposed on an upper surface thereof, at least one pair of signal transmission terminals disposed on a lower surface thereof, and at least one pair of connection structures electrically connecting the at least one pair of signal transmission lines to the at least one pair of signal transmission terminals,
• wherein the at least one pair of connection structures includes,
• a first connection structure including first via structures alternately disposed on a first vertical axis and a second vertical axis, and a first connection line connecting one of the first via structures on the first axis and one of the first via structures on the second axis, and
• a second connection structure including second via structures alternately disposed on a third vertical axis and a fourth vertical axis, and a second connection line connecting one of the second via structures on the third axis and one of the second via structures on the fourth axis,
• wherein the first vertical axis and the second vertical axis are spaced apart from each other in a first diagonal direction, and
• wherein the third vertical axis and the fourth vertical axis are spaced apart from each other in a second diagonal direction intersecting the first diagonal direction.

A semiconductor package comprising:

• a wiring board including at least one pair of signal transmission lines disposed on an upper surface thereof, at least one pair of signal transmission terminals disposed on a lower surface thereof, and at least one pair of connection structures electrically connecting the at least one pair of signal transmission lines to the at least one pair of signal transmission terminals,
• wherein the at least one pair of connection structures includes,
• first via structures disposed in a staggered manner along a first vertical axis and a second vertical axis, and
• second via structures disposed in a staggered manner along a third vertical axis and a fourth vertical axis,
• wherein the first vertical axis and the second vertical axis are positioned between a first and second transmission terminal of the at least one pair of signal transmission terminals in plan view, and
• wherein the third vertical axis and the fourth vertical axis and are positioned between the first and second transmission terminal of the at least one pair of signal transmission terminals in plan view.