Flip-chip ball grid array-type integrated circuit package for very high frequency operation

A flip-chip ball grid array type integrated circuit package comprising:

• a dielectric body having an upper face and an underside in which:
• the underside of the dielectric body comprises a plurality of receiving pads for means of connection, comprising a central signal receiving pad and peripheral ground receiving pads surrounding the central signal receiving pad;
• a plurality of stacks of signal vias, electrically connected to the central signal receiving pad, and passing vertically through the dielectric body;
• a plurality of stacks of ground vias, electrically connected to the peripheral ground receiving pads, passing vertically through the dielectric body and forming a ring around the plurality of stacks of signal vias;
• wherein, in an upper part of the dielectric body:
• the plurality of stacks of signal vias are electrically connected to a lesser number of signal conducting bumps projecting from the upper face of the dielectric body;
• and
• at least two ground vias are connected, by means of conductive projections, to respective ground conductive bumps, projecting from the upper face of the dielectric body and forming a ring around signal conducting bumps.