Conveying radio frequency signals through an interposer
AssigneeNXP USA, Inc.
InventorsZhiwei Gong, Tsung Nan Lo, Wen Yuan Chuang
Life of this patent
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Abstract
An integrated circuit assembly includes first and second circuit portions, an interposer vertically disposed between the first and second circuit portions, the interposer having a plated through hole with a metallic sidewall, and a metallic pillar that extends through the plated through hole without touching the metallic sidewall. The metallic pillar and the plated through hole together form a vertical coaxial structure constructed and arranged to convey RF (radio frequency) signals between the first and second circuit portions. Embodiments are directed to both the integrated circuit assembly and to a method of manufacturing the integrated circuit assembly.
Claims20
An integrated circuit assembly, comprising:
- first and second circuit portions;
- an interposer vertically disposed between the first and second circuit portions, the interposer having a plated through hole with a metallic sidewall;
- and
- a metallic pillar that extends through the plated through hole between the first and second circuit portions without touching the metallic sidewall, the metallic pillar and the plated through hole together forming a vertical coaxial structure constructed and arranged to convey RF (radio frequency) signals between the first and second circuit portions.
A method of manufacturing a circuit assembly, comprising:
- providing a first circuit portion having a metallic pillar;
- applying an interposer to the first circuit portion, the interposer having a plated through hole with a metallic sidewall, the adhering performed such that the metallic pillar of the first circuit portion extends through the plated through hole of the interposer without touching the metallic sidewall and forms a vertical coaxial structure within the interposer;
- and
- applying a second circuit portion to the interposer opposite the first circuit portion such that the metallic pillar electrically connects to a metal region of the second circuit portion, the coaxial structure thereby disposed to convey RF (radio frequency) signals between the first circuit portion and the second circuit portion.
An integrated circuit assembly, comprising:
- a semiconductor die having a metallic pillar;
- an interposer disposed against the semiconductor die, the interposer having a plated through hole with a metallic sidewall;
- and
- a vertical coaxial structure having a center conductor formed by the metallic pillar and a shield formed by the plated through hole, the metallic pillar extending through the plated through hole without touching the metallic sidewall, the vertical coaxial structure constructed and arranged to convey RF (radio frequency) signals through the interposer.
Dependencies are inferred from the claim text.