Power architecture with dual core advance substrate

An electronic device, comprising:

• a printed circuit board;
• a first core comprising a first cavity, the first core formed from an organic material and the first cavity configured to house a DC capacitor for delivery of direct current to a die from a voltage source;
• a second core comprising a second cavity, the second core formed from an inorganic material and the second cavity configured to house an AC capacitor coupled to an output of the die for decoupling alternating current effects associated with the direct current;
• and
• an interposer layer disposed between the first core and the second core, configured to isolate the first core and the second core.

An electronic device, comprising:

• a voltage source for providing direct current power to a die;
• a first core formed from an organic material and comprising a first capacitor, the first capacitor delivering the direct current power to the die, and the first core isolating a DC domain of the electronic device;
• and
• a second core formed from an inorganic material and comprising a second capacitor, the second capacitor decoupling alternating current interference from an output of a die, and the second core isolating an AC domain of the electronic device.