Via micro-modules for through mold via replacement
AssigneeIntel Corporation
InventorsAdel A. Elsherbini, Telesphor Kamgaing
Life of this patent
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Abstract
Embodiments disclosed herein include die modules, electronic packages, and systems. In an embodiment, a die module comprises a first substrate and a first die over the first substrate. In an embodiment, the die module further comprises a second die over the first substrate adjacent to the first die. In an embodiment, the die module further comprises a via module through the first substrate. In an embodiment, the via module comprises a second substrate, where the second substrate comprises glass, and a via through the second substrate.
Claims18
A die module, comprising:
- a first substrate comprising a mold layer;
- a first die over the first substrate;
- a second die over the first substrate adjacent to the first die;
- and
- a via module through the first substrate, wherein the via module comprises:
- a second substrate, wherein the second substrate comprises glass, wherein the glass of the second substrate has an uppermost surface at a same level as the mold layer of the first substrate, and wherein a thickness of the second substrate is substantially equal to a thickness of the first substrate;
- and
- a via through the second substrate.
An electronic package, comprising:
- a package substrate;
- and
- a die module coupled to the package substrate, wherein the die module comprises:
- a first substrate comprising a mold layer;
- an opening through a thickness of the first substrate;
- a second substrate in the opening, wherein the second substrate is different than the first substrate, wherein the second substrate comprises glass, wherein the glass of the second substrate has an uppermost surface at a same level as the mold layer of the first substrate, and wherein a thickness of the second substrate is substantially equal to a thickness of the first substrate;
- a via through the second substrate;
- and
- a die over the first substrate.
An electronic system, comprising:
- a board;
- an electronic package coupled to the board;
- and
- a die module coupled to the electronic package, wherein the die module comprises:
- a first substrate comprising a mold layer;
- an opening through a thickness of the first substrate;
- a second substrate in the opening, wherein the second substrate is different than the first substrate, wherein the second substrate comprises glass, wherein the glass of the second substrate has an uppermost surface at a same level as the mold layer of the first substrate, and wherein a thickness of the second substrate is substantially equal to a thickness of the first substrate;
- a via through the second substrate;
- and
- a die over the first substrate.
Dependencies are inferred from the claim text.