Integrated circuit package including pin and barrel interconnects

A stack of integrated circuit packages, the stack comprising:

• a first integrated circuit package including a first integrated circuit mounted on a first plastic body, said first plastic body including a plurality of integral metal coated plastic barrels each electrically coupled to said first integrated circuit;
• and
• a second integrated circuit package including a second integrated circuit mounted on a second plastic body, said second plastic body including a plurality of integral metal coated pins each electrically coupled to said second integrated circuit,
• wherein said first and second integrated circuit packages are stacked, and said pins of said second integrated circuit package are within and electrically coupled to respective ones of said barrels of said first integrated circuit package.

An integrated circuit package comprising:

• a plastic body;
• a plurality of metal coated plastic pins each extending vertically and integrally from said body;
• a plurality of electrically conductive traces on a surface of said body, each electrically conductive trace being electrically coupled to at least one of said pins;
• and
• an integrated circuit mounted on a surface of said body and electrically coupled to at least some of said pins through respective ones of said electrically conductive traces.

An integrated circuit package comprising:

• a plastic body;
• a plurality of metal coated plastic barrels formed integrally with said body;
• a plurality of electrically conductive traces on a surface of said body and electrically coupled to at least one metal barrel;
• and
• an integrated circuit mounted on a surface of said body and electrically coupled to at least some of said barrels through respective ones of said electrically conductive traces.

An integrated circuit package comprising:

• a plastic body with electrically conductive traces thereon;
• an integrated circuit mounted on a surface of said body and electrically coupled to at least some of said electrically conductive traces;
• a means integral with said plastic body and electrically coupled to the electrically conductive traces for stacking said package with a second said integrated circuit package and for electrically coupling the integrated circuit to said second integrated circuit package,
• wherein said means comprises coated plastic pins extending vertically and integrally from said package body, said pins being coated with an electrically conductive material.