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US 2026/0247982 A1Published application
Semiconductor package, semiconductor module, semiconductor device, and semiconductor package manufacturing method
AssigneeSony Semiconductor Solutions Corporation
InventorsHirohisa YASUKAWA, Hiroyuki SHIGETA
Life of this patent
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Abstract
Disclosed herein is a semiconductor package including a semiconductor chip configured to have one of two surfaces thereof mounted with a circuit, the circuit formation surface constituting a circuit formation surface, a first shield layer configured to cover a side of the semiconductor chip and the other surface thereof, and a second shield layer configured to cover the circuit formation circuit.
Claims25
A semiconductor package, comprising:
- a semiconductor chip, including:
- a first surface;
- a second surface opposite the first surface;
- and
- one or more side surfaces provided between the first surface and the second surface,
- wherein one of the first surface or the second surface has a circuit mounted thereon;
- a first shield layer covering the one or more side surfaces and the other of the first surface or the second surface of the semiconductor chip;
- and
- a second shield layer covering the one of the first surface or the second surface of the semiconductor chip having the circuit mounted thereon,
- wherein the second shield layer includes at least one metal.
7 more elements
A semiconductor module, comprising:
- a substrate;
- and
- a semiconductor package mounted on the substrate,
- wherein the semiconductor package includes:
- a first semiconductor chip, including:
- a first surface;
- a second surface opposite the first surface;
- and
- one or more side surfaces provided between the first surface and the second surface,
- wherein one of the first surface or the second surface has a first circuit mounted thereon;
- a first shield layer covering the one or more side surfaces and the other of the first surface or the second surface of the first semiconductor chip;
- and
- a second shield layer covering the one of the first surface or the second surface of the first semiconductor chip having the first circuit mounted thereon, wherein the second shield layer includes at least one metal.
10 more elements
An electronic device, comprising:
- a substrate;
- and
- a semiconductor package mounted on the substrate,
- wherein the semiconductor package includes:
- a semiconductor chip, including:
- a first surface;
- a second surface opposite the first surface;
- and
- one or more side surfaces provided between the first surface and the second surface,
- wherein one of the first surface or the second surface has a circuit mounted thereon;
- a first shield layer covering the one or more side surfaces and the other of the first surface or the second surface of the semiconductor chip;
- and
- a second shield layer covering the one of the first surface or the second surface of the semiconductor chip having the circuit mounted thereon,
- wherein the second shield layer includes at least one metal.
11 more elements
A semiconductor package manufacturing method, comprising:
- covering by a second shield layer, one of a first surface or a second surface of a semiconductor chip having a circuit mounted thereon,
- wherein the first surface is opposite the second surface;
- and
- covering by a first shield layer, the other of the first surface or the second surface of the semiconductor chip and one or more side surfaces of the semiconductor chip provided between the first surface and second surface of the semiconductor chip,
- wherein the second shield layer includes at least one metal.
2 more elements
Dependencies are inferred from the claim text.