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US 2026/0282934 A1Published application
Electronic device
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsYuanhao YU, Wei Shuen KAO
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to an electronic device. The electronic device includes a substrate and a chip antenna disposed over the substrate at a first elevation with respect to the substrate. The first elevation is greater than a thickness of the chip antenna. The chip antenna is configured to radiate a first signal through a first electrical path.
Claims20
An electronic device, comprising:
- a substrate;
- and
- a chip antenna over the substrate at a first elevation with respect to the substrate, wherein the first elevation is greater than a thickness of the chip antenna, and wherein the chip antenna is configured to radiate a first signal through a first electrical path.
An electronic device, comprising:
- a first antenna configured to generate a first signal at a first frequency;
- and
- a second antenna configured to generate a second signal at a second frequency different from the first frequency,
- wherein the first antenna and the second antenna share an electrical path.
1 more element
An electronic device, comprising:
- a substrate;
- a chip antenna disposed on the substrate at a first elevation with respect to the substrate;
- and
- a monopole antenna disposed on the substrate at a second elevation with respect to the substrate, different from the first elevation.
1 more element
Dependencies are inferred from the claim text.