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US 10,923,408 B2Granted
Cavity packages
AssigneeInvensas Bonding Technologies, Inc.
InventorsShaowu Huang, Javier A. DeLaCruz, Liang Wang, Rajesh Katkar, Belgacem Haba
Life of this patent
Estimating the term…
Abstract
An integrated device package is disclosed. The integrated device package can include an integrated device die, an element, a cavity, and an electrical interconnect. The element can have an antenna structure. The element can be attached to a surface of the integrated device. The cavity can be disposed between the integrated device die and the antenna structure. The electrical interconnect can connect the integrated device die and the antenna structure.
Claims17
An integrated device package comprising:
- an integrated device die;
- an element comprising an antenna structure, the element attached to a surface of the integrated device die, the element directly bonded to the surface of the integrated device die without an intervening adhesive;
- a cavity disposed between the integrated device die and at least a portion of the antenna structure;
- and
- an electrical interconnect connecting the integrated device die and the antenna structure.
2 more elements
An integrated device package comprising:
- a package housing comprising a semiconductor material, the package housing comprising:
- an integrated device;
- an antenna structure directly bonded to the integrated device without an intervening adhesive;
- and
- a cavity disposed between the integrated device and at least a portion of the antenna structure;
- and
- an electrical interconnect connecting the integrated device and the antenna structure.
4 more elements
Dependencies are inferred from the claim text.