H10W 44/216
Waveguides
Official title: {Waveguides, e.g. strip lines}
H10W44/216 (Waveguides) appears on 1,248 US grants and 1,294 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,248
- Published applications
- 1,294
- Assignees
- 391
- Inventors
- 2,378
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 5 | 0 |
| 1992 | 3 | 0 |
| 1993 | 4 | 0 |
| 1994 | 4 | 0 |
| 1995 | 8 | 0 |
| 1996 | 10 | 0 |
| 1997 | 9 | 0 |
| 1998 | 10 | 0 |
| 1999 | 10 | 0 |
| 2000 | 10 | 0 |
| 2001 | 19 | 4 |
| 2002 | 25 | 30 |
| 2003 | 29 | 43 |
| 2004 | 29 | 36 |
| 2005 | 33 | 40 |
| 2006 | 28 | 28 |
| 2007 | 20 | 26 |
| 2008 | 26 | 27 |
| 2009 | 23 | 56 |
| 2010 | 32 | 38 |
| 2011 | 32 | 37 |
| 2012 | 49 | 47 |
| 2013 | 39 | 49 |
| 2014 | 39 | 38 |
| 2015 | 40 | 36 |
| 2016 | 59 | 56 |
| 2017 | 54 | 46 |
| 2018 | 63 | 59 |
| 2019 | 59 | 83 |
| 2020 | 76 | 118 |
| 2021 | 66 | 84 |
| 2022 | 87 | 86 |
| 2023 | 72 | 89 |
| 2024 | 70 | 62 |
| 2025 | 59 | 40 |
| 2026 | 31 | 36 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Package substrate with open air gap structures6 Oct 2026US 12,757,739 B2Intel Corporation
- Package on package semiconductor device with integrated antenna and method therefor15 Sep 2026US 12,738,634 B2NXP USA, Inc.
- Pitch-reducing solder interconnect for RF transitions15 Sep 2026US 12,740,428 B2NXP USA, Inc.
- Semiconductor structure comprising first III-V compound layerand second III-V compound layer and method of manufacture8 Sep 2026US 12,733,193 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated curcuit to dielectric substrate transition25 Aug 2026US 12,721,171 B2Analog Devices International Unlimited Company
- Semiconductor structure and method of manufacture8 Oct 2026US 2026/0313943 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Waveguides and fabrication thereof1 Oct 2026US 2026/0302580 A1Jones Microwave Inc
- Memory apparatus having buffer die24 Sep 2026US 2026/0293162 A1SK hynix Inc.
- Waveguide structures semiconductor package including the same20 Aug 2026US 2026/0246131 A1Samsung Electronics Co., Ltd.
- Conveying radio frequency signals through an interposer30 Jul 2026US 2026/0223686 A1NXP USA, Inc.
Most cited
By later US patents
- Microwave IC package307US 5,294,897 AMitsubishi Denki Kabushiki Kaisha · 1994
- Micro-patch antenna connected to circuits chips255US 5,903,239 AMatsushita Electric Industrial Co., Ltd. · 1999
- Three-dimensional microwave circuit carrier and integral waveguide coupler226US 5,045,820 AMotorola, Inc. · 1991
- Low-loss interface222US 7,782,156 B2ViaSat, Inc. · 2010
- Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system201US 8,983,399 B2Sony Corporation · 2015